| 孙中琪.PCB锡焊机器人技术综述[J].电气自动化,2016,(1):78~81 |
| PCB锡焊机器人技术综述 |
| A Technical Review of PCB Soldering Robots |
| 修订日期：2015-08-26 |
| DOI： |
| 中文关键词: PCB锡焊机器人 锡焊工艺 电烙铁焊接 高周波焊接 激光焊接 焊点图像检测 |
| 英文关键词:PCB soldering robot soldering technics iron soldering high frequcy soldering laser soldering soldering spot image detection |
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| 摘要点击次数: 10643 |
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| 中文摘要: |
| PCB锡焊机器人目前在电子制造业应用日益广泛。随着对焊接效率和质量要求的不断提高,对其系统设计、工艺、控制等技术提出了新的挑战。从锡焊机器人的构成与功能、锡焊工艺、控制技术和焊点图像检测四方面对锡焊机器人的关键技术进行归纳和总结,分析目前存在的主要技术问题,探讨未来的发展方向。 |
| 英文摘要: |
| Nowadays, PCB soldering robots are increasingly widespred in the electronics manufacturing industry. With ever-increasing demands on soldering efficiency and quality, new challenges appear towards its system design, process, control and other technologies. This article summarizes key technologies of soldering robots in four aspects:robost structure and function, soldering technics, control technology and soldering spot image detection. Furthermore, it analyzes existing major technical problems and discusses future development of soldering robots. |
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